Innovative Solutions for Sensor Products (MEMS, LiDAR, ...) and ASICs
SAND MicroSystems provides innovative solutions to larger leading as well as smaller and start-up companies to realize novel Sensor Products (like: MEMS, LiDAR, ...) and Analog/Mixed-Signal and RF ASICs (Application Specific Integrated Circuits).
We have already provided solutions for the Analog Front-end and Signal Conditioning of numerous Sensor Products like: MEMS Microphone, MEMS Mirror, Accelerometer, Pressure Sensors, LiDARs, Ultra High Speed Optical Interfaces (60 GHz) and etc.
We are experienced in offering:
Solutions for Prototypes on PCB
Strong focus on the specially challenging Analog/Mixed-Signal and RF parts and spice simulation with discrete components as a first product demonstrator in order to minimize the risks and challenges.
Solutions for Integration on Chip (ASIC)
These include feasibility study, cost and risk analysis, specification, system architecture, design and simulation of on-chip blocks (e.g. with Cadence, ADEXL), design review before tape-out, characterization, packaging and supply chain.
We train and coach Team/Project Managers as well as Engineers with state-of-the-art approaches towards higher effectiveness and on-time product development (time-to-market - TTM) through our direct technical hands-on involvement and approach in your running projects.
Design Review and Debug of Analog/Mixed-Signal and RF Parts
If you already have your ASIC Design team or work with an external ASIC design house, we can help you and your internal or external partner with our years of experience across the industry and numerous microelectronic products and international companies to minimize your risks and avoid costly and time consuming re-spins. With review and interpretation of design, simulation and measurement results we provide you with new solutions to meet the right decisions.